VLSI Architecture of High Throughput Processing Unit for Efficiently Executing 2D Convolution for Deep Neural Network based Applications
Gari, Bhanuprakash Reddy Peddasubbanna and Samui, Suman and Garai, Soumen (2023) VLSI Architecture of High Throughput Processing Unit for Efficiently Executing 2D Convolution for Deep Neural Network based Applications. In: 2023 8th International Conference on Computers and Devices for Communication (CODEC), Kolkata, India.
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Abstract
Convolution serves as a foundational component
enabling Deep Neural Networks (DNN) to extract meaningful
features from input data. This paper focuses on the real-time
architecture of a high-throughput processing unit (PU) designed
for 2D convolutions. Three distinct PU topologies are presented:
(a) a non-pipelined Multiply-Accumulate (MAC) based PU, (b)
a 2-stage pipelined MAC based PU, and (c) a 5-stage pipelined
MAC-based PU, which significantly reduces convolution process
delay. These proposed architectures are implemented on Field
Programmable Gate Arrays (FPGAs) using the Xilinx Vivado
tool. Resource utilization and latency are thoroughly assessed and
compared across various PU topologies on Artix-7 and Zynq-7
FPGA chips. Additionally, throughput is estimated and compared
for different kernel and image sizes, revealing a substantial
average improvement of 96.36% achieved by the pipelined MAC
with its five-stage design compared to the non-pipelined MACbased processing unit.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Electronics and Communication Engineering > VLSI Design and Embedded Systems |
| Divisions: | Electronics and Communication Engineering |
| Depositing User: | Unnamed user with email techsupport@mosys.org |
| Date Deposited: | 23 Oct 2026 09:06 |
| Last Modified: | 23 Oct 2026 09:06 |
| URI: | https://ir.vcenggw.ac.in/id/eprint/330 |
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